Interfacial reactions and growth kinetics for intermetallic compound layer between In–48Sn solder and bare Cu substrate

Keywords

Intermetallic, Soldering, Materials science, Substrate (aquarium), Layer (electronics)

References

• Metallurgy of low temperature Pb-free solders for electronic assemblyJ. Glazer — 1995
• Interfacial reactions in In-Sn/Ni couples and phase equilibria of the In-Sn-Ni systemChing-Yu Huang, Sinn-wen Chen — 2002
• GROWTH KINETICS OF INTERMETALLIC COMPOUNDS IN CHIP SCALE PACKAGE SOLDER JOINTP.L. Tu, Y.C. Chan, K.C. Hung — 2001
• The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi SoldersChang‐Bae Lee, Seung‐Boo Jung, Young-Eui Shin — 2001
• Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloysK.S Kim, Seok‐Hwan Huh, Katsuaki Suganuma — 2002
• Characterization of eutectic Sn-Bi solder jointsZ. Mei, J. W. Morris — 1992
• Intermetallic compound layer formation between copper and hot-dipped 100In, 50In-50Sn, 100Sn, and 63Sn-37Pb coatingsPaul T. Vianco, Paul F. Hlava, Alice C. Kilgo — 1994
• Advances in Bonding Technology for Electronic PackagingChin C. Lee, Chen Y. Wang, G. Matijasevic — 1993
• Interfacial microstructure and the kinetics of interfacial reaction in diffusion couples between Sn–Pb solder and Cu/Ni/Pd metallizationGautam Ghosh — 2000
• Solder joint reliability of indium-alloy interconnectionKozo Shimizu, Teru Nakanishi, Kazuaki Karasawa — 1995
• Intermetallic phase formation and shear strength of a Au-In microjointFuh‐Sheng Shieu, Chong-kun Chen, Jyh Sheen — 1999
• Microstructures developed in solid-liquid reactions: using Cu-Sn reaction, Ni-Bi reaction, and Cu-In reaction as examplesC. R. Kao — 1997
• Progress in the design of new lead-free solder alloysM. McCormack, Sungho Jin — 1993

Cited by

• Reliability study of lead-free solders under specific conditionsShuang Liu, Songbai Xue — 2015
• Electromigration in eutectic In-48Sn ball grid array (BGA) solder interconnections with Au/Ni/Cu padsYi Li, Fengshun Wu, Y.C. Chan — 2015
• The reliability of through silicon via under thermal cyclingHongxuan Ma, Jingdong Guo, Jianqiang Chen — 2015
• Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: Part I: Wetting behavior on Cu and Ni substratesM.J. Rizvi, C. Bailey, Y.C. Chan — 2007
• Formation and evolution of intermetallic compounds between the In-3Ag solder and Cu substrate during solderingYunzhu Ma, Huiting Luo, Yongjun Li — 2015
• Reliability of In-48Sn solder/Au/Ni/Cu BGA packages during reflow processJa‐Myeong Koo, Seung‐Boo Jung — 2005
• Modeling of interfacial intermetallic compounds in the application of very fine lead-free solder interconnectionsZhiheng Huang, Paul Conway, Rongshan Qin — 2008
• Microstructure and mechanical strength of snag-based solid liquid inter-diffusion bonds for 3 dimensional integrated circuitsLeila Ladani, Jafar Razmi, Jordan Bentley — 2010
• Martensitic Transformation in Sn-Rich SnIn Solder JointsK.-O. Lee, J. W. Morris, Fay Hua — 2012
• The reversible transformation between Cu2(In, Sn) and Cu(In, Sn)2 compounds during solid-state agingZhi‐Quan Liu, Feifei Tian — 2014
• Electrochemical migration and electrochemical corrosion behaviors in 3wt.% NaCl solution of 64Sn-35Bi-1Ag solder with in doping for micro-nanoelectronic packagingsHua Li, Wei Dai, Liansheng Duan — 2012
• Diffusion wave model and growth kinetics of interfacial intermetallic compounds in Sn–3.0Ag–0.5Cu–xTiO2 solder jointsYu Tang, G. Y. Li, Shuqiong Luo — 2015
• Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrateFeifei Tian, Zhi‐Quan Liu, Pan-Ju Shang — 2014
• Study on the Solidus Line in Sn-Rich Region of Sn-In Phase DiagramC.-H. Yeh, L.-S. Chang, Boris B. Straumal — 2009
• Interfacial characteristics of molten Bi-43Sn alloy on amorphous and crystalline Fe78B13Si9Guofeng Ma, H.L. Zhang, H.F. Zhang — 2008
• Joining of Bi-2212 high-Tc superconductors and metals using indium soldersSeong Yong Oh, H.R. Kim, Yeon‐Tae Jeong — 2007
• Microstructure and Growth Behavior of the Intermetallic Compound for Sn-1.0Ag-0.5Cu-NiB/Cu Solder Joint InterfaceJun Feng Qu, Jun Xu, Qiang Hu — 2013
• Microstructure and impression creep behavior of lead-free Sn–5Sb solder alloy containing Bi and AgA.R. Geranmayeh, G. Nayyeri, R. Mahmudi — 2012
• Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal agingM.J. Rizvi, Yin‐Ching Chan, C. Bailey — 2006
• Precise Cr-marker investigation on the reactive interface in the eutectic SnIn solder jointFeifei Tian, Pan-Ju Shang, Zhi‐Quan Liu — 2014

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