Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: Part I: Wetting behavior on Cu and Ni substrates

Keywords

Wetting, Soldering, Materials science, Contact angle, Substrate (aquarium)

References

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Cited by

• Recent advances on Sn–Cu solders with alloying elements: reviewGuang Zeng, Songbai Xue, Liang Zhang — 2011
• Complex structure/composition relationship in thin films of AlCoCrCuFeNi high entropy alloyV. Dolique, A. L. Thomann, Pascal Brault — 2009
• The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder jointsGuang Zeng, Stuart D. McDonald, Qinfen Gu — 2015
• Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn-Cu solder alloy.Satyanarayan, K. Narayan Prabhu — 2011
• Study on Wettability of Sn-Xwt%Cu SolderBo‐In Noh, Jeong‐Won Yoon, Bui Quoc Vu — 2007
• Wettability of Sn–Zn, Sn–Ag–Cu and Sn–Bi–Cu Alloys on Copper SubstratesXiaorui Zhang, Hiroyuki Matsuura, Fumitaka Tsukihashi — 2012
• Effect of reflow temperature and substrate roughness on wettability, IMC growth and shear strength of SAC387/Cu bondsKiran N. Bhat, K. Narayan Prabhu, Satyanarayan — 2014
• Effect of Ag content and the minor alloying element Fe on the electrical resistivity of Sn-Ag-Cu solder alloyNur Aishah Aminah Mohd Amin, Dhafer Abdulameer Shnawah, Suhana Mohd Said — 2014
• Undercooling Behavior and Solidification Microstructure Evolution of Sn-Cu-Ni Solders Modified by Minute Amount of Mixed Rare Earth La-CeMin Zhou, Xiao Ma, Xin Ping Zhang — 2010
• Effect of aluminium additions on wettability and intermetallic compound (IMC) growth of lead free Sn (2 wt. % Ag, 5 wt. % Bi) soldered jointsHee Yul Lee, Ashutosh Sharma, Se Ho Kee — 2014
• Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) jointsGuang Zeng, Stuart D. McDonald, Dekui Mu — 2014
• Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubesY. D. Han, Hong Yang Jing, Mui Ling Sharon Nai — 2012
• Reactive wetting behaviors of Sn/Cu systems: A molecular dynamics studyJin Yuan Hsieh, J. L. Chen, C. Chen — 2010
• Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni AlloysC.M. Gourlay, Kazuhiro Nogita, J. Read — 2010
• Wetting of Sn-0.7Cu solder alloy on different substrates at different temperaturesHenggang Yin, Jun Shen, Qin Tang — 2012
• Wetting in Soldering and MicroelectronicsTaihei Matsumoto, K. Nogi — 2008
• The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder jointsGuang Zeng, Stuart D. McDonald, Dekui Mu — 2016
• Interfacial Reaction between Sn-Ag-Cu-Mg Solder and ENIG SubstrateHiroshi Nishikawa, Abdulaziz Alhazaa, Siliang He — 2016
• Effects of sulfur addition on the wettability and corrosion resistance of Sn-0.7Cu lead-free solderHuizhen Huang, Shuai Gewang, Xiuqin Wei — 2017
• Nanomechanical characterization of IMCs formed in SAC solder joints subjected to isothermal agingAbdullah Fahim, Sudan Ahmed, Jeffrey C. Suhling — 2017

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