Electrochemical migration and electrochemical corrosion behaviors in 3wt.% NaCl solution of 64Sn-35Bi-1Ag solder with in doping for micro-nanoelectronic packagings
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- Type
- article
- Published
- 2012-08-01
- Cited by
- 4
- References
- 15
- OpenAlex
- https://openalex.org/W1979384825
- Semantic Scholar
- https://api.semanticscholar.org/CorpusID:32235801
Keywords
Materials science, Doping, Electrochemistry, Intermetallic, Corrosion
References
- Reliability of In-48Sn solder/Au/Ni/Cu BGA packages during reflow process
- Electrochemical migration behaviors of lead-free 64Sn-35Bi-1Ag solder on FR-4 PCB board plated with Cu
- Interfacial reactions and growth kinetics for intermetallic compound layer between In–48Sn solder and bare Cu substrate
- Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization
- Progress on soldering failure analysis during the period of enlistment in micro-nanoelectronic packaging
- Electrochemical migration of lead free solder joints
- Effects of Ge Doping on Electrochemical Migration, Corrosion Behavior and Oxidation Characteristics of Lead-Free Sn-3.0Ag-0.5Cu Solder for Electronic Packaging
- Electrochemical Growth and Control of ZnO Dendritic Structures
- Fractal Description of Dendrite Growing During Electrochemical Migration
- Copper Dendrites : Synthesis, Mechanism Discussion, and Application in Determination of L-Tyrosine
- Physics and materials challenges for lead-free solders
- Corrosion behavior, whisker growth, and electrochemical migration of Sn-3.0Ag-0.5Cu solder doping with In and Zn in NaCl solution
- Electrochemical migration tests of solder alloys in pure water
- Electrochemical and mechanical behaviour of Sn‐2.5Ag‐0.5Cu and Sn‐48Bi‐2Zn solders
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