Wetting of Sn-0.7Cu solder alloy on different substrates at different temperatures

Keywords

Wetting, Soldering, Materials science, Alloy, Metallurgy

References

• Interface Reaction and Mechanical Properties of Lead-free Sn-Zn Alloy/Cu JointsIkuo Shohji, Takao Nakamura, Fuminari Mori — 2002
• Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: Part I: Wetting behavior on Cu and Ni substratesM.J. Rizvi, C. Bailey, Y.C. Chan — 2007
• Solid-state growth kinetics of Ni3Sn4 at the Sn–3.5Ag solder∕Ni interfaceM.O. Alam, Y.C. Chan — 2005
• Surface tension and viscosity of liquid metalsI. Egry, G. Lohöfer, Stefan Sauerland — 1993
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• Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni-P by the molten Sn3.5Ag0.5Cu solder alloyMobinul Islam, Y. C. Chan, Ahmed Sharif — 2003
• Study on reactive wetting of Sn0.7Cu-xZn lead-free solders on Cu substrateHongqin Wang, Fengjiang Wang, Feng Gao — 2005
• Six cases of reliability study of Pb-free solder joints in electronic packaging technologyKe Zeng, K. N. Tu — 2002
• Microstructural Evolution and Tensile Properties of SnAgCu Mixed with Sn-Pb Solder Alloys (Preprint)Fengjiang Wang, Matthew J. O’Keefe, Brandon Lee Brinkmeyer — 2009
• Variation of silicon melt viscosity with boron additionSuzuka Nishimura, Satoru Matsumoto, Kazutaka Terashima — 2002
• On the relation between surface tension and viscosity for liquid metalsI. Egry — 1993
• Heat resistance of Sn-9Zn solder/Cu interface with or without coatingKatsuaki Suganuma, Toshikazu Murata, Hiroji Noguchi — 2000
• Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free SoldersNing Zhao, Xuemin Pan, Daquan Yu — 2009
• The Cu-Sn (Copper-Tin) systemNigel J. Saunders, A. P. Miodownik — 1990
• Interfacial reactions on electrolytic Ni and electroless Ni(P) metallization with Sn–In–Ag–Cu solderAhmed Sharif, Y. C. Chan — 2005
• Wetting: statics and dynamicsP. G. de Gennes — 1985
• Dissolution of Au, Ag, Pd, Pt, Cu and Ni in a Molten Tin-Lead SolderW. G. Bader — 1969
• High-temperature brazing1956

Cited by

• Reliability issues of lead-free solder joints in electronic devicesNan Jiang, Liang Zhang, Zhi‐Quan Liu — 2019
• Enhancement of bonding strength in BiTe-based thermoelectric modules by electroless nickel, electroless palladium, and immersion gold surface modificationYen Ngoc Nguyen, Subin Kim, Sung Hwa Bae — 2021

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