Effect of De-Twinning on Tensile Strength of Nano-Twinned Cu Films
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Summary
The plastic deformation of nano-twinned Cu films is governed by the de-twinning of the nano-Twinned structure, which is proportional to the twin-boundaries density.
- Type
- article
- Published
- 2021-06-22
- Cited by
- 7
- References
- 46
- Access
- Open access
- OpenAlex
- https://openalex.org/W3173944789
- Semantic Scholar
- https://api.semanticscholar.org/CorpusID:235715556
Keywords
Crystal twinning, Necking, Materials science, Grain boundary, Ultimate tensile strength
References
- In Situ Nanoindentation Studies on Detwinning and Work Hardening in Nanotwinned Monolithic Metals
- Fracture in a thin film of nanotwinned copper
- Nanoindentation behavior of nanotwinned Cu: Influence of indenter angle on hardness, strain rate sensitivity and activation volume
- The role of shear stress in the formation of annealing twin boundaries in copper
- Investigation of annealing twins in F.C.C. metals
- Twin stability in highly nanotwinned Cu under compression, torsion and tension
- Influence of stacking fault energy on twin spacing of Cu and Cu–Al alloys
- Detwinning, damage and crack initiation during cyclic loading of Cu samples containing aligned nanotwins
- Formation of dislocation networks in a coherent Cu Σ3(1 1 1) twin boundary
- Thermal stability of twins and strengthening mechanisms in differently oriented epitaxial nanotwinned Ag films
- Revealing the Maximum Strength in Nanotwinned Copper
- Deformation structures in ball milled copper
- Nanotwinned fcc metals: Strengthening versus softening mechanisms
- Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper
- Annealing twin formation and recrystallization study of cold-drawn copper wires from EBSD measurements
- Nanotwin formation and its physical properties and effect on reliability of copper interconnects
- The influence of grain boundary inclination on the structure and energy of Σ=3 grain boundaries in copper
- Nanotwinned microstructures from low stacking fault energy brass by high-rate severe plastic deformation
- Ultrahigh Strength and High Electrical Conductivity in Copper
- Plastic deformation mechanism in nanotwinned metals: An insight from molecular dynamics and mechanistic modeling
Cited by
- Significantly improving the mechanical/electrical characteristics of blind-hole Cu filling through crystal coherent modification
- Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing
- Research Progress of Electroplated Nanotwinned Copper in Microelectronic Packaging
- Computational Analysis of Gold–Platinum Nanowires Subjected to Uniaxial Tensile Loading
- Cu-CNTs composite foils with twinning-induced high ductility
- Direction-dependent mechanical strength of nanostructure-tuned copper
- Cu-Cnts Composite Foils with Twinning-Induced High Ductility
- Oxidation on Nano-Twinned and Polycrystalline Cu Films
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