Advanced heat exchange technology for thermoelectric cooling devices

Keywords

Thermoelectric cooling, Heat exchanger, Condenser (optics), TEC, Thermosiphon

References

• Rationally Based Heat Transfer and Friction Correlations for the Louver Fin GeometryEric R. Dillen, Ralph L. Webb — 1994
• An introduction to heat pipesPatrick E. Phelan — 1996
• Nucleate pool boiling data for five refrigerants on plain, integral-fin and enhanced tube geometriesRalph L. Webb, Christopher Pais — 1992
• Condensation of R-12 in small hydraulic diameter extruded aluminum tubes with and without micro-finsC-Y. Yang, Ralph L. Webb — 1996
• Principles of enhanced heat transfer1994
• Conversion Efficiency and Figure-of-MeritH. Goldsmid — 1995

Cited by

• Fabrication of micro bumps for micro scale thermal managementA. A. Kardak — 2008
• CO2 transcritical vapor compression cycle with thermoelectric subcoolerJonathan Schoenfield, Yunho Hwang, Rienhard Radermacher — 2012
• An investigation of thermoelectric cooling devices for small‐scale space conditioning applications in buildingsMark Gillott, Liben Jiang, Saffa Riffat — 2009
• Performance simulation and experimental testing of a novel thermoelectric heat pump systemSaffa Riffat, Xiaoli Ma, Robin Wilson — 2006
• Improving the coefficient of performance of thermoelectric cooling systems: a reviewSaffa Riffat, Xiaoli Ma — 2004
• Theoretical Determination of a Thermoelectric Module and Heat Sinks SizingAnthony A. Adeyanju, W. Richard Compton — 2010
• Numerical Optimization of the Thermoelectric Cooling DevicesB. Abramzon — 2007
• Heat Transfer Mechanisms for Condensation and Vaporization Inside a Microfin TubeDavide Del Col, Ralph L. Webb, Ram Narayanamurthy — 2002
• EFFECT OF CONDENSER LOCATION AND IMPOSED CIRCULATION ON THE PERFORMANCE OF A COMPACT TWO-PHASE THERMOSYPHONLang Yuan, Yogendra Joshi, Wataru Nakayama — 2003
• Spot cooling using thermoelectric microcoolersDa‐Jeng Yao, Chang‐Jin Kim, Gang Chen — 1999
• Integration of a Thermoelectric Subcooler into a Carbon Dioxide Transcritical Vapor Compression Cycle Refrigeration SystemJonathan Michael Schoenfeld — 2008
• Test results on a thermo-syphon concept to high-power cool desktop computers and serversRalph L. Webb — 2002
• Thermal Devices Integrated With Thermoelectric Modules With Applications to CPU CoolingIoan Sauciuc, Hakan Ertürk, G. Chrysler — 2005
• Heat transfer from square pin-fin heat sinks using air impingement coolingJ.G. Maveety, Hoon Hyung Jung — 2002
• Design and characterization of a cylindrical, water‐cooled heat sink for thermoelectric air‐conditionersSaffa Riffat, Guoquan Qiu — 2006
• Cooling of high heat flux electronic devices by two phase thermosyphon systemYasin, Aysar Mahmud Masud — 2007
• Numerical Optimization of the Thermoelectric Cooling SystemsB. Abramzon — 2006
• Achieving high efficiency thermoelectric heating and cooling with metal foam heat exchangersG. Clark — 2014
• Methodological Considerations of Using Thermoelectrics with Fin Heat Sinks for Cooling ApplicationsKok Tong Ong, Choon S. Tan, Koon Chun Lai — 2017
• Modeling fabrication and characterization of a bio-micro thermoelectric device for highly localized temperature controlAparna Prabhakar — 2006

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