Onset of void coalescence during dynamic fracture of ductile metals.

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Summary

Molecular dynamics simulations in three-dimensional copper are performed to quantify the void coalescence process leading to fracture, finding the critical intervoid ligament distance marking the onset of coalescence to be approximately one void radius.

Type
article
Published
2004-10-24
Cited by
90
References
22
Access
Open access

Keywords

Coalescence (physics), Void (composites), Materials science, Molecular dynamics, Critical radius

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