Onset of void coalescence during dynamic fracture of ductile metals.
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Summary
Molecular dynamics simulations in three-dimensional copper are performed to quantify the void coalescence process leading to fracture, finding the critical intervoid ligament distance marking the onset of coalescence to be approximately one void radius.
- Type
- article
- Published
- 2004-10-24
- Cited by
- 90
- References
- 22
- Access
- Open access
- OpenAlex
- https://openalex.org/W2001149672
- Semantic Scholar
- https://api.semanticscholar.org/CorpusID:21963421
Keywords
Coalescence (physics), Void (composites), Materials science, Molecular dynamics, Critical radius
References
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- Dislocation nucleation and defect structure during surface indentation
- The elastic field outside an ellipsoidal inclusion
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- Canonical dynamics: Equilibrium phase-space distributions.
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- On the ductile enlargement of voids in triaxial stress fields
- The effect of void arrays on void linking during ductile fracture
- Effect of stress-triaxiality on void growth in dynamic fracture of metals: a molecular dynamics study
- A simulation of void linking during ductile microvoid fracture
- Dynamic failure of solids
- Polymorphic transitions in single crystals: A new molecular dynamics method
- A modeling study of the effect of stress state on void linking during ductile fracture
- Void growth and coalescence in porous plastic solids
- Micromechanical finite element calculations of temperature and void configuration effects on void growth and coalescence
- Continuum Theory of Ductile Rupture by Void Nucleation and Growth: Part I—Yield Criteria and Flow Rules for Porous Ductile Media
- Atomistic Modeling of Void Growth and Coalescence in Ni+H
- Simple embedded atom method model for fcc and hcp metals
- Shock Compression of Condensed Matter–1991
Cited by
- Effects of void–crack interaction and void distribution on crack propagation in single crystal silicon
- Molecular dynamics simulation of the influence of elliptical void interaction on the tensile behavior of aluminum
- Atomistic Modeling of Spall Response in a Single CrystalAluminum
- Atomic-scale analysis of plastic deformation in thin-film forms of electronic materials
- Atomic-scale analysis of defect dynamics and strain relaxation mechanisms in biaxially strained ultrathin films of face-centered cubic metals
- Predicted Optimum Composition for the Glass-Forming Ability of Bulk Amorphous Alloys: Application to Cu-Zr-Al.
- Molecular dynamics simulation of polycrystalline molybdenum nanowires under uniaxial tensile strain : Size effects
- Atomistic simulation of the mechanical properties of nanoporous gold
- Strong configurational dependence of elastic properties for a binary model metallic glass
- Interaction of voids and nanoductility in silica glass.
- Two Critical Damage Parameters for the Dynamic Tensile Fracture of Ductile Metal
- Atomic scale simulations of ductile failure micromechanisms in nanocrystalline Cu at high strain rates
- Dislocation creation and void nucleation in FCC ductile metals under tensile loading: A general microscopic picture
- A STUDY OF THE CRITICAL FRACTURE BEHAVIOR OF HIGH PURITY ALUMINUM IN THE DYNAMIC LOADING
- Damage property of incompletely spalled aluminum under shock wave loading
- Molecular dynamics modeling and simulation of void growth in two dimensions
- Nanovoid nucleation by vacancy aggregation and vacancy-cluster coarsening in high-purity metallic single crystals
- Temperature sensitivity of void nucleation and growth parameters for single crystal copper: a molecular dynamics study
- Atomic scale studies of spall behavior in nanocrystalline Cu
- Void growth in bcc metals simulated with molecular dynamics using the Finnis–Sinclair potential
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