Charakterisierung und Optimierung elektrochemisch abgeschiedener Kupferdünnschichtmetallisierungen für Leitbahnen höchstintegrierter Schaltkreise
Explore this paper's citation graph
- Type
- article
- Published
- 2007-12-10
- Cited by
- 1
- References
- 251
- Access
- Open access
- OpenAlex
- https://openalex.org/W259825625
- Semantic Scholar
- https://api.semanticscholar.org/CorpusID:135956804
Keywords
Computer science
References
- Grains, Phases, and Interfaces an Interpretation of Microstructure
- Adsorption of mercaptopropionic acid onto Au(1 1 1): Part II. Effect on copper electrodeposition
- Adsorption of mercaptopropionic acid onto Au(1 1 1): Part I. Adlayer formation, structure and electrochemistry
- The chemistry of the additives in an acid copper electroplating bath
- Electrochemistry: Principles, Methods, and Applications
- Copper-Fundamental Mechanisms for Microelectronic Applications
- Diffusion in Metallen
- Recrystallization of metallic materials
- Fundamentals of Electrochemical Deposition
- Relationship between interfacial adhesion and electromigration in Cu metallization
- Grain structure evolution during annealing of electroplated Copper
- The Materials Science of Thin Films
- Effect of interface strength on electromigration-induced inlaid copper interconnect degradation: Experiment and simulation
- Roles of chloride ion in microvia filling by copper electrodeposition -II. Studies using EPR and galvanostatic measurements
- Recrystallization and Related Annealing Phenomena
- Non‐Arrthenius Behaviour and Divacancy Contribution in Self‐Diffusion of 64Cu in Cu
- Thermodynamics and kinetics of room-temperature microstructural evolution in copper films
- Substrate curvature due to thin film mismatch strain in the nonlinear deformation range
- Microstructural characterization of inlaid copper interconnect lines
- Electromigration resistance-related microstructural change with rapid thermal annealing of electroplated copper films
Cited by
Related papers
No related papers recorded.