Processing, reliability and integration issues in chemical mechanical planarization
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- Type
- article
- Published
- 2005-01-01
- Cited by
- 5
- References
- 32
- Access
- Open access
- OpenAlex
- https://openalex.org/W55725381
- Semantic Scholar
- https://api.semanticscholar.org/CorpusID:135282705
Keywords
Chemical-mechanical planarization, Reliability (semiconductor), Reliability engineering, Computer science, Forensic engineering
References
- Chemical-mechanical planarization of semiconductor materials
- High Resolution XPS of Organic Polymers: The Scienta ESCA300 Database
- Polyolefins : modification of structure and properties
- VLSI metallization : physics and technologies
- Metallization: Theory and practice for VLSI and ULSI
- Modeling of chemical mechanical polishing for dielectric planarization
- Silicon Processing for the VLSI Era
- Engineering with surface coatings: The role of coating microstructure
- Chemical Mechanical Planarization of Microelectronic Materials
- Modeling of chemical mechanical polishing for shallow trench isolation
- Material removal mechanism in chemical mechanical polishing: theory and modeling
- Modeling of chemical mechanical polishing for shallow trench isolation
- Wear characterization of polyurethane chemical mechanical polishing pads
- Patent pending
Cited by
- Kinematic analysis of in situ measurement during chemical mechanical planarization process.
- Physical and statistical analysis of functional process variables for process control in semiconductor manufacturing
- Statistical and Experimental Analysis of Correlated Time-Varying Process Variables for Conditions Diagnosis in Chemical–Mechanical Planarization
- Consumable Process Development for Chemical Mechanical Planarization of Bit Patterned Media for Magnetic Storage Fabrication
- Evaluation of Chemical Mechanical Planarization Capability of TitanTM Wafer Carrier on Silicon Oxide
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