Package-Level Interconnect Design for Optimum Electrical Performance
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Summary
This paper presents an overview of the electrical analysis and electrical design processes and techniques used to develop package-level interconnect technologies to meet Intel’s present and future performance challenges.
- Type
- article
- Published
- 2000-01-01
- Cited by
- 14
- References
- 16
- OpenAlex
- https://openalex.org/W45014897
- Semantic Scholar
- https://api.semanticscholar.org/CorpusID:59177033
Keywords
Motherboard, Power integrity, Signal integrity, Computer science, Interconnection
References
- Book Review: High-Speed Digital Design: A Handbook of Black Magic by Howard W. Johnson and Martin Graham: (Prentice-Hall, 1993)
- Microwave Circuit Analysis and Amplifier Design
- Advanced Engineering Electromagnetics
- Validation of integrated capacitor-via-planes model
- Design considerations for low-voltage on-board DC/DC modules for next generations of data processing circuits
- Investigation of candidate VRM topologies for future microprocessors
- A new technique for high frequency characterization of capacitors
- Enhancing power distribution system through 3D integrated models, optimized designs, and switching VRM model
- Introduction to electromagnetic compatibility
- VRM transient study and output filter design for future processors
- Introduction to electromagnetic compatibility
Cited by
- Development of Modeling, Simulation and Measurement Methodologies for Signal Integrity Analysis of High-Speed Packaging Interconnects
- Modeling of power distribution networks with retardation using the transmission matrix method
- Solution space analysis of interconnects for low voltage differential signaling (LVDS) applications
- Challenges of small form factor 0402 and 0201 die side capacitor assembly process on high density interconnect flip chip substrate
- Physical layout automation for system-on-packages
- Current demand balancing: a technique for minimization of current surge in high performance clock-gated microprocessors
- Applications of a 3-D field solver for on-chip and package microstrip interconnection design
- Integrated architectural/physical planning approach for minimization of current surge in high performance clock-gated microprocessors
- Analysis and optimization of power grids
- Modeling of power distribution networks with signal lines for SPICE simulators
- Priority assignment optimization for minimization of current surge in high performance power efficient clock-gated microprocessor
- CPU Package Design Optimization for Performance Improvement and Package Cost reduction
- Integrated architectural/physical planning approach for minimization of current surge in high performance clock-gated microprocessors
- Bypassing, Decoupling, and Power Distribution
- A Complete Bibliography of Publications in the Intel Technology Journal