Chip integration using inkjet-printed silver conductive tracks reinforced by electroless plating for flexible board packages

Romain Cauchois, Mohamed Saadaoui, Jacques Legeleux, Thierry Malia · Minerva Urology and Nephrology · 2012

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Type: article
Published: 2012-04-25
Cited by: 2
References: 12
Access: Open access
DOI: https://doi.org/10.23736/s2724-6051.21.04244-2
OpenAlex: https://openalex.org/W33781021
Semantic Scholar: https://api.semanticscholar.org/CorpusID:55458378

Keywords

Electronics, Interconnection, Printed circuit board, Chip, Computer science

References

Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packagesRomain Cauchois, Mohamed Saadaoui, Jacques Legeleux — 2010
Thermal behavior of silver nanoparticles for low-temperature interconnect applicationsKyoung‐sik Moon, Hai Dong, Radenka Marić — 2005
Small particle melting of pure metalsG.L. Allen, R. A. Bayles, W.W. Gile — 1986
Mechanical characterization of solution-derived nanoparticle silver ink thin filmsJulia R. Greer, R. A. Street — 2007
Size effect on the melting temperature of gold particlesPh. Buffat, JP Borel — 1976
The size effect and the non-local Boltzmann transport equation in orifice and disk geometryG Wexler — 1966
Low-temperature and Pressureless Sintering Technology for High-performance and High-temperature Interconnection of Semiconductor DevicesGuo‐Quan Lu, Jesus N. Calata, Guangyin Lei — 2007
All-inkjet-printed flexible electronics fabrication on a polymer substrate by low-temperature high-resolution selective laser sintering of metal nanoparticlesSeung Hwan Ko, Heng Pan, Costas P. Grigoropoulos — 2007
Electrical sintering of nanoparticle structuresMark Allen, Mikko Aronniemi, Tomi Mattila — 2008
Mechanical properties of porous and fully dense low-Îº dielectric thin films measured by means of nanoindentation and the plane-strain bulge test techniqueYong Xiang, Xi Chen, Ting Y. Tsui — 2006

Cited by

Greek cross test structure for inkjet printed thin filmsElkin Diaz, Eloi Ramón, Jordi Carrabina — 2013
Digital Fabrication and Integration of a Flexible Wireless Sensing DeviceP. Mei, B. S. Krusor, David E. Schwartz — 2017

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